Sika Sikadur 23, Lo-Mod Gel

Sikadur 23, Lo-Mod Gel, is a 2-component, 100% solids, moisture-tolerant, low-modulus, non-sag paste-consistency, epoxy resin binder. It conforms to the current ASTM C-881 and AASHTO M-235 specifications.



  • Non-sag consistency
  • Convenient easy to mix ratio A:B=1:1 by volume
  • Moisture-tolerant epoxy adhesive binder


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